June 4-9, 2017

IMS-2017, The IEEE International Microwave Symposium will be held at the Hawaii

Convention Center, Honolulu Hawaii, USA. Microsanj will have an exhibit at booth 1751

and will be hosting a 2 hour workshop entitled: “Analyzing the Thermal Behavior of

Advanced Microwave Devices & ICs”. The workshop will be highly interactive and will

give attendees a greater appreciation of the importance and benefits of the thermal

imaging technique based on thermoreflectance to achieve optimal microwave device

performance while ensuring long-term device reliability. For more information see:

http://ims2017.org/

 November 5-9, 2017 ISTFA Conference


Pasadena Convention Center
Pasadena, California, USA

http://www.asminternational.org/web/istfa-2017


MicrosanJ Speaking Events 2017

October 22 - 25, 2017


2017 IEEE Compound Semiconductor IC Symposium

https://csics.org/

Miami Marriott Biscayne Bay
1633 N. Bayshore Drive
Miami, FL

Thermoreflectance, Nanotherm NT100, Nanotherm 200 series,Thermoreflectance Imaging, Nanotherm NT310

IPFA-2017, Symposium on the Physical and


Failure Analysis of Integrated Circuits in


Chengdu, CHINA for more information see:


http://www.ipfa2017.com/

May 22-25,2017


CS-MANTECH

Hyatt Regency~Indian Wells,CA


https://www.compoundsemiconductor.net/event/417/


www.csmantech.org

2. Therminic 2017, 27-29 Sept 2017, Amsterdam.

Therminic is the premier IC thermal conference in Europe and I think it would be good for us to continue our good effort in the 2016 workshop into the one next year. For the paper, we can give equal emphasis to Thermal Analysis and FA. You may wish to check with Ali if he has new results that he would like to include in the paper for this Workshop. The CFP is not yet out but I thin the deadline for abstracts is around mid-April. I am a member of the Advisory Committee of this Workshop.

October 8  - 13th 2017

European Microwave Integrated Circuits Conference 2017 - See more at:


http://www.eumweek.com/conferences/eumic.html#sthash.rlxrH5hL.dpuf


Nuremberg, Germany

MICROSANJ  EVENTS 2017

Andrew Tay speaking opportunity

1. IPFA 2017, 4-7 July 2017, Chengdu, China.

Please find details in the CFP attached. This is being held this year in Chengdu, China, and is focused on Faiiure Analysis and Reliability of electronic devices. This is quite an established international conference. It is actually owned by the Singapore ED/CPMT/REL Chapter. In the even years it is held in Singapore, and in the odd years, it is held somewhere in Asia outside Singapore. I foresee that it will attract many failure analysis people from all over China and will be a good platform to advertise the capabilities of Microsanj Imaging Systems. China views IC technology as strategic as it is pervasive in all the military and economy. China knows it is now way behind the West and is determined to catch up by 2020. As can be seen in the attached file China's Budget for IC Development, it has announced very large budgets for supporting IC development from 2014 till 2020. This means that many government institutes and universities have funds to purchase equipment. I would like to recommend that we submit a paper to IPFA 2017 showcasing how Microsanj systems can be used for Thermal Anaysis and Failure Analysis, with greater emphasis on the latter. We could shorten the thermal analysis part of our Therminic 2016 paper and add on more FA examples. Deadline for submission of abstracts is Feb 24.

May 30 – June 2, 2017

I-THERM 2017 The Intersociety Conference on Thermal and Thermomechanical

Phenomena in Electronic Systems will take place at the Walt Disney World Swan and

Dolphin Resort in Orlando, Florida, USA. The paper entitled “Accurate Thermoreflectance Imaging of Nano-Features Using Thermal Decay” will be presented.

http://www.ieee-itherm.org

July 4th - 7th, 2017

89th ARFTG Microwave Measurement Symposium will take place at the Ala Moana Hotel in Honolulu, Hawaii on June 9, 2017. Dr. Ali Shakouri will be a keynote speaker presenting the paper, “Thermal Transport in Transistors Based on GaN and Novel 2D Materials” for more information see: http://www.arftg.org/

 

3. Semicon SEA, 25-27 April 2017, Penang, Malaysia

Please find more details from http://www.semiconsea.org/. The conference theme is "Cost Efficient Miniaturization of Semiconductor Fabrication -- from Chip to PCB Level Integration". I have been invited to be one of the Invited Speakers at the Forum onf IC Failure Analysis. In my talk, I plan to showcase Microsanj's capability for thermal and failure analysis of today's sub-micron devices. I will refer heavily to the content of the papers we presented at Therminic 2016 and will be presenting at Therminic 2017 and IPFA 2017. As you know, Semicon is more focused on industry and usually attracts a lrge number of visitors from industry. In 2016, Semicon SEA attracted more than 7000 visitors, mostly from the Asia-Pacific region.

June 9, 2017

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